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            Up to 64 layers

            Max thickness .374” (9.5 mm)

            Max panel size 24X48” (612x1219mm)

            M-Tg, Hi-Tg, low Dk/Df materials

            Press fit holes

            Controlled impedance

            Backdrilling Multiple depths, both sides

            BBlind vias, Dual Vias, Air via

            BBlind press-fit holes

            BCover PI-film on the surface

            BImmersion Tin or OSP or ENIG

            Reliability testing Thermal stress, IST, T-260

            Used as backbone of network switches/routers, servers and basestations