1. <tr id="hbkg0"></tr>
          1. <strike id="hbkg0"></strike>

            LC(Line Card)

            Up to 40 Layers

            High density designs

            Max thickness 0.180”(4.5mm)

            Max panel size 24X42”(612X1070mm)

            Line/space to 3.0/3.0 mils (76um/76um, inner layers)

            Min core 1.0 mils (25.0um)

            Via in pad (POFV/VIPPO)

            0.2mm drill size

            0.5mm BGA

            Various structure types

            1.N+N;

            2.N+N+N;

            3.N+2+N

            Processes available:

            LDI (Laser Directing Image)

            8 camera post-etch punch

            CCD Back-drilling

            久久婷婷五月综合色精品首页-国产欧美久久久精品-欧美精品九九99久久在免费线