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            HDI(Higth Density Interconnec)

            HDI = High Density Interconnect (Micro via)

            Layer count –up to 34 L

            Maximum thickness – 200mils (5.0mm)

            Max panel size 24X36”(612X916mm)

            Laser hole size : 3.9 ~ 16mil

            Various structure types:

            1+N+1

            2+N+2

            3+N+3

            Various via types:

            Staggered , Skip Vias 1-4, Stacked

            Via-in-pad designs

            Epoxy filled

            Via filling

            Plated over filled via (POFV/VIPPO)

            Conformal, large window , DLD Process

            Currently 14 Gauss +2 Top-hat CO2 laser drills

            Used in hi-speed line cards

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