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            Heat sinks(Metal-backed PCB)

            Production since 2003

            Hybrid or Teflon PCB’s

            Bonded to thick Copper pallets ( 1mm – 5mm)

            Large WPNL size

            Experience with Pre-bonded, Post-bonded, Press fit, embedded and various coin designs

            Coin assembly by Bonding film, PSA , Embedded coin & Press fit

            Special team to support NPI and production

            Special team to support NPI and production

            Used in Power amplifiers or RF modules

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